The companies will collaborate on industry-leading HBM4 supply for AMD Instinct™ MI455X GPUs and next-generation DDR5 solutions for AMD EPYC™ processors and the AMD Helios platform

Samsung Electronics Co., Ltd. today announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI memory and computing technologies.

The signing ceremony was held at Samsung's most advanced chip manufacturing complex in Pyeongtaek, Korea, attended by Dr. Lisa Su, Chair and CEO of AMD, and Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics.