Xanadu Quantum Technologies Ltd. ("Xanadu") (NASDAQ:XNDU) (TSX:XNDU), a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems. Throughout this partnership, Xanadu and EVG expect to utilize EVG's industrial manufacturing tools to fabricate the specialized chips used in Xanadu's photonic quantum computers, with the goal of accelerating the progression of quantum computing chip manufacturing from the lab to high-volume production.

As the semiconductor and photonics industries evolve, heterogeneous integration has emerged as a high-growth frontier. It allows for the seamless combination of multiple functional materials and platforms—such as silicon, lithium niobate, and III-V semiconductors—onto a single, unified chip. EVG's industry-leading bonding expertise helps Xanadu engineer the high-precision and ultra-clean interfaces required to bring together the photonic chip material stack across different platforms. This process is integral to Xanadu's mission of building a quantum data centre that is both manufacturable and scalable.