onsemi today unveiled the Embedded Power Platform (EPP), redefining system power delivery through unprecedented power density and integration of multiple dies into a single silicon device. By jointly optimizing electrical, mechanical and thermal performance within a single architecture, EPP enables up to 3 – 5x higher power density compared with current solutions with a highly integrated approach to power system design. This helps customers reduce complexity while scaling for the increasing demands of AI infrastructure and electrification.

SCOTTSDALE, Ariz., Sept. 16, 2026 (GLOBE NEWSWIRE) -- onsemi today unveiled the Embedded Power Platform (EPP), a breakthrough architecture that uses the silicon wafer itself as the foundation of the package and introduces a highly integrated approach to power system design. Designed as a scalable platform, EPP brings electrical, mechanical and thermal design together from the outset to help customers achieve higher power density, improve system performance and accelerate development in AI, electrification and autonomous applications.