Interlink Electronics, Inc. (NASDAQ:LINK) ("Interlink" or the "Company"), a global leader in sensor technology and printed electronic solutions, today announced that it has entered into a non-binding letter of intent ("LOI") for a potential strategic acquisition. The proposed acquisition target is an established provider of high-performance manufacturing solutions to customers operating in mission-critical sectors, including semiconductor, defense, laser and photonics, commercial high-tech, and aerospace. Based on information made available to the Company by the proposed target, the target generated more than $33 million in revenue and approximately $4 million in EBITDA for 2025.

The Company currently expects that, if the proposed transaction is consummated, the consideration would be financed through a combination of indebtedness incurred by the Company and the issuance of equity securities by the Company to the sellers, with the equity valued based on the prevailing market price at the time of closing subject to a minimum price of $5.00 per share and a maximum price of $10.00 per share. The final financing structure, however, remains subject to ongoing evaluation, negotiation, and definitive documentation.