The patent application describes a multi-component composite thermoplastic filament formulated for use in standard fused deposition modeling (FDM) three-dimensional printers. The filament, composed of a PETG polymer matrix combined with aluminum flake, carbonyl iron powder, carbon black, and milled carbon fiber, produces 3D-printed drone enclosures that achieve broadband shielding effectiveness of 35 to 55 dB across the full frequency range of 10 kHz to 10 GHz, as measured per ASTM D4935.

Unlike metallic Faraday enclosures or conductive gaskets that impose weight and manufacturing complexity penalties incompatible with modern UAV size, weight, and power constraints, the Company's filament is designed for use with commercially available desktop FDM printers, enabling on-demand production of EMP-hardened drone enclosures and electronics housings at the unit level.

Strategic Significance: A Documented Gap in the Drone Defense Ecosystem

Electromagnetic pulse attacks represent one of the most consequential unsolved problems in autonomous drone warfare. A single EMP event -- whether generated by a high-altitude nuclear detonation, a non-nuclear electromagnetic device, or a high-power microwave weapon -- can simultaneously destroy the semiconductor components and flight control systems of an entire drone swarm. No publicly listed drone defense company, including platforms the Company monitors as market comparables, currently offers a fielded EMP-hardening solution at the drone enclosure level.

Quantum Cyber believes this patent application establishes its first-mover position in EMP hardening for autonomous systems, a capability layer that management views as essential infrastructure for any serious drone defense platform. The Company intends to integrate this technology across its developing System-of-Systems portfolio.

"EMP hardening has been a known gap in drone defense for years, and every military deploying drone swarms is exposed to it," said David Lazar, Chief Executive Officer of Quantum Cyber. "We have developed a real, manufacturable solution using standard 3D printing equipment and commercially available materials. The assignment is written into the specification, the claims are tightly drawn, and this goes directly onto our patent portfolio. We intend to move quickly to integrate this capability across our platform."