Qualcomm Technologies, Inc. (NASDAQ:QCOM) today announced at its Investor Day, new data center solutions, including the Qualcomm Dragonfly™ C1000 CPU, Qualcomm® High Bandwidth Compute (HBC), Qualcomm Dragonfly™ AI300 inference accelerator, and connectivity products, together with custom silicon solutions, all engineered to maximize performance per watt and token throughput at lower total cost of ownership. The new platforms highlight Qualcomm Technologies’ growing role in building full‑stack data center infrastructure optimized for AI, spanning agentic and data‑center‑class CPUs, AI inference accelerators, high‑performance connectivity, and at scale custom silicon solutions. The Qualcomm Dragonfly AI300 joins the previously announced Qualcomm Dragonfly AI200 and AI250 in its data center solutions portfolio with an annual cadence AI accelerator roadmap.